Surface Finishes

• Understanding OSP Protection In Pb-free Processing
  by Dr. Witold Paw, Dr. Jun Nable, John Swanson, MacDermid Electronics Solutions
  
  Advancements and evolutions in printed circuit board manufacturing, design, and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surface finishes. More specifically, developments in OSP chemical processes are aimed at producing a durable finish which ensures that a board surface retains solderability through more challenging and harsh Pb-free assembly conditions. From this, it is clear that advancements in OSP processing and coating performance require a solid understanding of the mechanisms associated with coating formation and thermally driven degradation. We take a look at OSP structure and composition and how it is affected by heat treatments. Additionally, mechanisms of degradation of OSP are proposed along with possible strategies to remedy it.

• Cupric Chloride-HCl Acid Microetch Roughening Process
  by Kesheng Feng, Nilesh Kapadia, Brian Jobson, Steve Castaldi, MacDermid
  
  Copper surface roughening is an important step to achieve good adhesion for dryfilm photo resist and solder mask in PCB fabrication. The roughening process can be accomplished by mechanical means, such as pumice scrubbing or brushing, or by chemical micro etching means. Mechanical cleaning methods are not suited to the processing of thinner core or fine line boards. The micro etch chemical methods commonly used are ferric chloride, persulfate salt, and hydrogen peroxide-sulfuric acid. Recently, a new micro etching chemistry, cupric chloride-hydrochloric acid-additives, was introduced. The chemistry creates unique roughened copper surface topography. This type of roughness can be used for various processes where good adhesion to copper surfaces is needed.

PCB Fabrication

• Modularised And Standardised PCB Manufacturing
  by Pascal Simon, Dyconex
  
  A modularised concept for the fabrication of printed circuit boards can deliver exceptional benefits. In addition to simplicity and ease of use for the engineer, modularisation inherently leads to standardisation of products because the same process modules are used over and over again. Most importantly, it reduces the effort necessary to optimise processes by allowing modules to be updated. In addition to streamlining the engineering process on the manufacturer’s side, such a concept can also provide advantages for the customer such as process stability, good lead times and improved traceability.

Smart Cards, RFID & Emerging Technologies

• Integrated Smart Label Production Solutions
  by Delo, Intune and Mühlbauer
  
  The market for contactless labels has passed through the trough and out the other side – RFID is gaining momentum again: IDTechEx’s analysts have identified more than 3,000 RFID projects worldwide in the past year. The market volume in this line of business is currently US$ 5 billion. China has the greatest share with more than 40 percent, due to its national ID program in which all ID cards are equipped with RFID. In addition to growing demand, production costs for RFID labels and readers are decreasing through increased industrialization. As a result, RFID applications are spreading even further in diverse value chains.

Assembly

• Interconnect Miniaturisation And Mass-Imaging Platforms
  by Clive Ashmore, Dek Printing Machines
  
  For most process engineers, the print process is the first to be set-up and the last to be questioned when something goes wrong. Within this industry, it is also a well-known fact that over 60% of all defects are attributable to the print process. So why do engineers tend to overlook the print process? And why does the print process provide the majority of defects? A series of experiments were conducted to answer these questions.