OnBoard Technology´s editorial focus covers high-level design, manufacturing, assembly and test technologies and equipment. Topics include Advanced Materials, SBUs (Sequential Build-Ups), MIDs (Moulded Interconnect Devices), Area Arrays, Flip-Chip assembly, MCMs (Multi-Chip Modules), HDI (High Density Interconnects), HDP (High Density Packaging), Smart Cards and RFID Tags, Lead-free Soldering, Microsystem Technology, MEMS and MOEMS. [...]